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Dual 50MHz to 1000MHz High-Linearity,
Serial/Parallel-Controlled Analog/Digital VGA
ABSOLUTE MAXIMUM RATINGS
V CC_AMP_1 , V CC_AMP_2 , V CC_RG to GND ..........-0.3V
STA_A_1, STA_A_2, STA_B_1, STA_B_2,
PD_1, PD_2, AMPSET to GND .........................-0.3V
A_VCTL_1, A_VCTL_2 to GND .............................-0.3V
DAT, CS , CLK, AA_SP, DA_SP to GND ...............-0.3V
D0_1, D1_1, D2_1, D3_1, D4_1, D0_2, D1_2,
D2_2, D3_2, D4_2 to GND ...............................-0.3V
AMP_IN_1, AMP_IN_2 to GND ..........................+0.95V
AMP_OUT_1, AMP_OUT_2 to GND .....................-0.3V
D_ATT_IN_1, D_ATT_IN_2, D_ATT_OUT_1,
D_ATT_OUT_2 to GND ......................................... 0V
A_ATT_IN_1, A_ATT_IN_2, A_ATT_OUT_1,
A_ATT_OUT_2 to GND ......................................... 0V
to +5.5V
to +3.6V
to +3.6V
to +3.6V
to +3.6V
to +1.2V
to +5.5V
to +3.6V
to +3.6V
REG_OUT to GND ................................................-0.3V to +3.6V
RF Input Power (D_ATT_IN_1, D_ATT_IN_2) ............... +20dBm
RF Input Power (A_ATT_IN_1, A_ATT_IN_2) .............. +20dBm
RF Input Power (AMP_IN_1, AMP_IN_2)...................... +18dBm
q JC (Notes 1, 2) ......................................................... +12.3 N C/W
q JA (Notes 2, 3) ............................................................ +38 N C/W
Continuous Power Dissipation (Note 1) ..............................5.3W
Operating Case Temperature Range (Note 4) .. -40 N C to +85 N C
Junction Temperature .....................................................+150 N C
Storage Temperature Range............................ -65 N C to +150 N C
Lead Temperature (soldering, 10s) ................................+300 N C
Soldering Temperature (reflow) ......................................+260 N C
Note 1: Based on junction temperature T J = T C + ( q JC x V CC x I CC ). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150 N C.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Note 3: Junction temperature T J = T A + ( q JA x V CC x I CC ). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150 N C.
Note 4: T C is the temperature on the exposed pad of the package. T A is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = 4.75V to 5.25V, AMPSET = 0, PD_1 = PD_2 = 0,
T C = -40 N C to +85 N C. Typical values are at V CC_ = 5.0V and T C = +25 N C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
SYMBOL
V CC
I DC
I DCPD
CONDITIONS
PD_1 = PD_2 = 1, V IH = 3.3V
MIN
4.75
TYP
5
148
5.3
MAX
5.25
210
8
UNITS
V
mA
mA
Logic-Low Input Voltage
V IL
0.5
V
Logic-High Input Voltage
Input Logic Current
V IH
I IH, I IL
1.7
-1
3.465
+1
V
F A
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V CC = V CC_AMP_1 = V CC_AMP_2 = V CC_RG = 3.135V to 3.465V, AMPSET = 1, PD_1 = PD_2 = 0,
T C = -40 N C to +85 N C. Typical value s are at V CC _ = 3.3V and T C = +25 N C, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
Power-Down Current
SYMBOL
V CC
I DC
I DCPD
CONDITIONS
PD_1 = PD_2 = 1, V IH = 3.3V
MIN
3.135
TYP
3.3
87
4.5
MAX
3.465
145
8
UNITS
V
mA
mA
Logic-Low Input Voltage
Logic-High Input Voltage
V IL
V IH
0.5
1.7
V
V
2
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